Remanufacturing and Repair Capabilities

Circuit Board Medics combines years of electronic experience with advanced technology and equipment to solve even the most challenging problems. We are eager to tackle hard issues. Whether you are looking for trouble shooting genius or advanced machinery, we have the answer. While some are intimidated by hurdles like Ball Grid Array (BGA) rework or Wire Bond replacement, we embrace challenges and excel where others would give up. Our precision and quality lead to excellence and customer satisfaction you can depend on.

What is Wire Bonding?

Wire bonding involves using a thin wire, typically made of aluminum or gold, to create a precise connection between circuit board components. Commonly used in manufacturing, it establishes electrical pathways in components without needing bulky connectors or soldering. Restoring wire bonds on a circuit board can be a meticulous process. Due to the nature of this type of connection, modules using wire bonding experience failure due to age, vibration, or heat stress.

Why Do Companies Use Wire Bonding?

Manufacturers choose wire bonding because it's a cost-effective, scalable solution for mass production. It offers excellent electrical performance with low resistance and inductances. This means electronic systems that require fast signal transmission with minimal interference or signal loss. In these applications, electrical connections must support high-frequency signals without introducing excessive resistance, capacitance, or inductance, which can distort or slow down data transmission.

Our Wire Bonding Solution

Wire bonds can be rebonded, making them a product that can be remanufactured while applying minimal thermal stress to sensitive components. Circuit Board Medics uses state-of-the-art wire bonding machines for our remanufacturing and repairs. These machines ensure micron-level precision, creating durable, reliable electrical connections with consistent quality which is crucial in creating durable, long-lasting bonds.

What is BGA?

A BGA (Ball Grid Array) is a type of soldering where electrical connections are made through an array of solder balls beneath the component. Unlike traditional pin-based components, BGAs rely on these solder balls to establish strong electrical and mechanical bonds with the circuit board. The rework process requires precise heating, desoldering, reballing, and reinstallation using specialized equipment.

Why Do Companies Use BGA?

BGAs are often used in critical components such as processors, memory chips, and microcontrollers that are costly to replace or unavailable as direct replacements. This is common in automotive, aerospace, and industrial electronics, where long product lifecycles demand upgradeable components.

Our BGA Capabilities

Instead of scrapping defective boards, reworking BGAs extends the lifespan of electronics, saves money, and allows these failures or defects to be corrected without discarding the entire board reducing e-waste and lowering environmental impact. We use state-of-the art BGA machinery and x-ray technology to ensure every solder ball in correctly place with no unseen defects.

Selective Soldering

Selective soldering is a preferred method for precisely soldering through-hole components while avoiding heat exposure to sensitive surface-mount technology (SMT) components. Selective soldering allows targeted solder applications without disturbing nearby components and ensures long-term reliability without overheating delicate components.

Pick and Place

Pick and place is an automated process used in PCB (Printed Circuit Board) assembly to accurately place surface-mount components onto the board. It involves robotic machines that "pick" tiny electronic components to then precisely "place" them onto designated positions on a circuit board before soldering.

AOI (Automated Optical Inspection)

Automated Optical Inspection (AOI) is a quality control process used in PCB manufacturing to detect defects and inconsistencies in circuit boards using high-resolution cameras, lighting, and image-processing software. AOI systems scan PCBs to check for missing, misaligned, or incorrect components, soldering defects, and other visual issues before final assembly.

X-Ray Inspection

X-ray inspection is a non-destructive way to see through circuit board components, which is essential for identifying solder voids, cold solder joints, bridging, and insufficient solder connections in complex assemblies.

Bench Troubleshooting Equipment

Specially designed testing and workbenches to ensure quality repairs.

SMD/THT

Surface Mount Devices (SMD) and Through-Hole Technology (THT) are based on how components are mounted onto a Printed Circuit Board (PCB).

In-House Manufacturing

  • 3D Printing
  • CNC Machining
  • Calibration Tools and Apps for Remanufactured Actuators
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